Mark Popovich is an international executive and experienced leader of the Engineered Materials, Semiconductor and Electronic Manufacturing markets. Most recently he was the Corporate Vice President, Global Head of New Business Development for Henkel Adhesive Technologies (~9B Euro/yr), where he led the efforts to expand the business into adjacent markets as well as Corporate Venture Capital team for investments into Start-Ups. Prior to this, he was Corporate Vice President, Global Head of Marketing and Business Units for Henkel’s, Electronic Materials Group. He also served on the Board of Directors for two Start-Ups, Vitriflex, Inc and DropWise Technologies, Inc.
Prior to Henkel, he was Amkor Technology’s Corporate Vice President & GM of APAC. He resided in Asia from 2004-2014, living in both Tokyo and Singapore. He led the establishment of J-Devices Corp, a Joint Venture between Amkor, Toshiba and NMD which is now the largest outsourced semiconductor manufacturer in Japan.
Prior to Amkor, he was a founding member of ChipPAC (a Start-Up spin-out of Hyundai Electronics), Inc, where he led Business Development and Product Strategy. Prior to ChipPAC, he was with Motorola and Analog Devices in RF related product development.
Mr. Popovich holds a B.S. in Ceramic Science and Engineering from The Pennsylvania State University, USA. He holds four patents related to Microelectronic Packaging.